| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy plate or bar, wherein lead deformation of a lead frame is hardly caused, and the time required for stress relief annealing after press processing is short. SOLUTION: The copper alloy or bar contains 0.4 to 6.0 mass% Ni and 0.1 to 2.0 mass% Si, and the balance Cu and inevitable impurities, wherein the absolute value of the residual stress at depth of 1μm from the surface is≤50 Mpa, and the tensile strength is decreased by≥40 MPa by heat treatment of heating for one minute at 500°C. COPYRIGHT: (C)2010,JPO&INPIT
|
