| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus for electronic parts, which can form a plated film having little distribution of the film thickness on the electronic parts. SOLUTION: This plating apparatus continuously charges long substrates Sa and Sb which are broken into a strip form, into a plating tank 34 in a tandem state, and at this time, passes a larger amount of an electric current to entrance side rollers R1 and R2 of the plating tank 34 in which a plating current is supplied to one pair of electrodes than that to the outlet side rollers R3 and R4. Thereby, the plating currents to be supplied to the rollers R1, R2, R3 and R4 are adequately balanced between the rollers in an entrance side and the rollers in the outlet side of the plating tank 34, which reduces the distribution of the plating currents, which may occur between surface electrodes of the continuous long substrates Sa and Sb and anodes, and suppresses the distribution of the plated-film thickness. COPYRIGHT: (C)2010,JPO&INPIT |
