发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 A semiconductor device includes: a semiconductor substrate including a trench; a capacitor electrode formed in the trench; a first insulation film formed on a bottom of the trench and between the semiconductor substrate and the capacitor electrode; a second insulation film formed on a side wall of the trench and between the semiconductor substrate and the capacitor electrode; and a first metal oxide film formed at the bottom of the trench and between the capacitor electrode and the first insulation film.
申请公布号 US2010006913(A1) 申请公布日期 2010.01.14
申请号 US20090499197 申请日期 2009.07.08
申请人 FUJITSU MICROELECTRONICS LIMITED 发明人 LIN JUN;OGAWA HIROYUKI
分类号 H01L27/108;H01L21/8234;H01L21/8242 主分类号 H01L27/108
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