发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A semiconductor device includes: a semiconductor substrate including a trench; a capacitor electrode formed in the trench; a first insulation film formed on a bottom of the trench and between the semiconductor substrate and the capacitor electrode; a second insulation film formed on a side wall of the trench and between the semiconductor substrate and the capacitor electrode; and a first metal oxide film formed at the bottom of the trench and between the capacitor electrode and the first insulation film.
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申请公布号 |
US2010006913(A1) |
申请公布日期 |
2010.01.14 |
申请号 |
US20090499197 |
申请日期 |
2009.07.08 |
申请人 |
FUJITSU MICROELECTRONICS LIMITED |
发明人 |
LIN JUN;OGAWA HIROYUKI |
分类号 |
H01L27/108;H01L21/8234;H01L21/8242 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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