| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board with a built-in component which is small in load with respect to manufacture, and to provide a method of manufacturing the same. <P>SOLUTION: The wiring board with the built-in component includes an electric/electronic component, a first plate-like insulating layer which is embedded in at least part of the electric/electronic component in contact with at least part of a surface of the electric/electronic component, a first conductor provided penetrating the first plate-like insulating layer while avoiding the position of the electric/electronic component, a first wiring layer provided on an upper surface of the first plate-like insulating layer so as to electrically connect with the first conductor, a second wiring layer provided on an lower surface of the first plate-like insulating layer which faces the upper surface so as to electrically connect with the first conductor, a second conductor which electrically and mechanically connect a terminal of the electric/electronic component to the second wiring layer and is made of the same composition material as the first conductor, and a second plate-like insulating layer which is stacked on the second wiring layer to be interposed with the first plate-like insulating layer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
