| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a light emitting apparatus which is excellent in heat dissipation, prevents destruction caused by thermal expansion coefficient difference with a printed board and prevents inclination in light-emitted direction, and to provide an optical scanning apparatus and an image forming apparatus. <P>SOLUTION: The light emitting apparatus 50 includes: a surface emitting laser 10 provided with a separate electrode 12 and a common electrode 13 on both upper and lower surfaces; and a ceramic package 20 wherein a mount portion 31 for mounting the surface emitting laser 10 is provided to a bottom surface 26 of an opening part 22 and the common electrode 13 of the surface emitting laser 10 is electrically connected to the mount portion 31. The ceramic package 20 has a back-surface electrode 32 provided to a periphery of a lower surface and a back-surface heat-dissipating electrode 33 provided to a center of the lower surface. The mount portion 31 is electrically connected to the back-surface electrode 32 via a common electrode lead wiring provided to the ceramic package 20 and also thermally connected to a back-surface heat-dissipating electrode 33 via a penetrating electrode 36 that penetrates between an opening part bottom 26 and the lower surface of the ceramic package 20. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
