SPIN COATING METHOD, METHOD OF PRODUCING SOLID IMAGING ELEMENT, AND METHOD OF PRODUCING DEVICE

摘要

<P>PROBLEM TO BE SOLVED: To enhance the uniformity of the film thickness in the plane of a wafer by spin coating. Ž<P>SOLUTION: A color resist 41R' as a coating material is applied onto a wafer 101 by spin coating while the wafer 101 is kept in a state wherein an annular convex 101a is formed on its outer circumferential part 53 outside the chip area 52 of the wafer 101. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž