| 摘要 |
A new way of realizing microwave devices, such as electromagnetic transmission lines, waveguides and circuits of them, is disclosed, that is advantageous when the frequency is so high that existing transmission lines and waveguides have too large losses or cannot be manufactured cost-effectively with the tolerances required. Thus, the new technology is intended to replace coaxial lines, hollow cylindrical waveguides, and microstrip lines and other substrate-bound transmission lines at high frequencies. The microwave devices are realized by a narrow gap between two parallel surfaces of conducting material, by using a texture or multilayer structure on one of the surfaces. The fields are mainly present inside the gap, and not in the texture or layer structure itself, so the losses are small. The microwave device further comprises one or more conducting elements, such as a metal ridge or a groove in one of the two surfaces, or a metal strip located in a multilayer structure between the two surfaces. The waves propagate along the conducting elements. No metal connections between the two metal surfaces are needed. At least one of the surfaces is provided with means to prohibit the waves from propagating in other directions between them than along the ridge, groove or strip. At very high frequency the gap waveguides and gap lines may be realized inside an IC package or inside the chip itself. |
