| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition capable of satisfying both excellent plating resistance and storage stability in addition to developability, hardness, heat resistance and sensitivity necessary for a solder resist; a photosensitive laminate having a photosensitive layer comprising the photosensitive composition; a permanent pattern forming method using the photosensitive composition; and a printed circuit board on which a permanent pattern is formed by the permanent pattern forming method. <P>SOLUTION: The photosensitive composition includes a binder, a polymerizable compound, a photopolymerization initiator, a heat crosslinking agent and a compound represented by a general formula (1). In the general formula (1), X represents an organic linking chain selected from the group consisting of -O-, -NH-, -NY-, S-, -CH<SB>2</SB>- and -Ar-, Y represents an organic functional group, Ar represents a 6-20C arylene group; and R represents an organic functional group. <P>COPYRIGHT: (C)2010,JPO&INPIT |
