发明名称 |
METHOD OF MANUFACTURING CHIP MADE OF BRITTLE MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of inexpensively manufacturing a chip made of a brittle material like a semiconductor chip in good yield by using a brittle ingot protected with an embedding resin when the chip made of the brittle material like the semiconductor chip is manufactured from the brittle ingot like a semiconductor ingot. SOLUTION: The method of manufacturing the chip made of brittle material includes an embedding process of embedding the brittle ingot in the embedding resin, a slicing process of slicing the embedded brittle ingot to form a wafer, and a cutting process of cutting the wafer into chips. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010010299(A) |
申请公布日期 |
2010.01.14 |
申请号 |
JP20080166366 |
申请日期 |
2008.06.25 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
KOBAYASHI KENTARO;SADAMATSU KAZUHISA;IBE HIROYUKI;HIRATA KAZUNORI |
分类号 |
H01L21/304;B28D7/04;H01L21/301 |
主分类号 |
H01L21/304 |
代理机构 |
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