发明名称 METHOD OF MANUFACTURING CHIP MADE OF BRITTLE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a method of inexpensively manufacturing a chip made of a brittle material like a semiconductor chip in good yield by using a brittle ingot protected with an embedding resin when the chip made of the brittle material like the semiconductor chip is manufactured from the brittle ingot like a semiconductor ingot. SOLUTION: The method of manufacturing the chip made of brittle material includes an embedding process of embedding the brittle ingot in the embedding resin, a slicing process of slicing the embedded brittle ingot to form a wafer, and a cutting process of cutting the wafer into chips. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010010299(A) 申请公布日期 2010.01.14
申请号 JP20080166366 申请日期 2008.06.25
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 KOBAYASHI KENTARO;SADAMATSU KAZUHISA;IBE HIROYUKI;HIRATA KAZUNORI
分类号 H01L21/304;B28D7/04;H01L21/301 主分类号 H01L21/304
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