A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.
申请公布号
US2010007004(A1)
申请公布日期
2010.01.14
申请号
US20090501246
申请日期
2009.07.10
申请人
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
发明人
CHANG HSIAO CHUAN;TSAI TSUNG YUEH;LAI YI SHAO;TONG HO MING;CHEN JIAN CHENG;YIH WEI CHI;HUNG CHANG YING;HUANG CHENG WEI;CHEN CHIH HSING;HUANG TAI YUAN;CHEN CHIEH TING;LU YI TSAI