| 摘要 |
A cooling system to cool an electronic component is disclosed. The cooling system includes a first connection to receive refrigerant, a region to transfer heat from an electronic component to the refrigerant from the first connection, at least one of a cooling coil, a cooling tube, or a cooling block positioned in the region and in fluid communication with the first connection, and a second connection to return refrigerant from the region to an evaporator.
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