| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device favorably joining a semiconductor element having a through electrode with another semiconductor element. <P>SOLUTION: The semiconductor device includes a substrate, a first semiconductor element formed at least on one side of the substrate and a second semiconductor element having a conductor part formed through the device in its thickness direction. The first and second semiconductor elements are electrically connected together via a projection electrode and a first adhesion layer composed of a hardened substance of a resin composition containing a crosslink-reactive resin and a compound having flux activity is disposed between the first and second semiconductor elements. <P>COPYRIGHT: (C)2010,JPO&INPIT |
