| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device where an effective area on the upper face of an island is increased while adhesion between the island and a sealant resin 104 is improved, and its method for manufacturing. <P>SOLUTION: The semiconductor device 10 mainly including a semiconductor device 18, the island 14 on which the device 18 is mounted, leads 12A, 12 B that are electrically connected to the device 18 through metal wires 16A, 16B, and a sealant resin 24 that seals the device 18 and the like and having a step 30 at a periphery of the of the island 14 wherein, since the step 30 is configured of a first step 32 and a second step 34, adhesion strength between an insulating resin 24 and the island 14 is improved by allowing these parts to be fitted into the resin 24. <P>COPYRIGHT: (C)2010,JPO&INPIT |
