发明名称 SEMICONDUCTOR PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To microfabricate, without deteriorating an element, a semiconductor which is constructed with a work-function control metal conductor deposited on a high dielectric insulating film. SOLUTION: The semiconductor has an insulating film 102 containing Hf or Zr, formed on a semiconductor substrate 101 and a conductive film 103 containing Ti, Ta, or Ru, formed on the insulating film. The semiconductor processing method is to process the conductive film in a plasma atmosphere using a resist 107 formed on the conductive film, and the resist 107 is removed in the plasma atmosphere containing hydrogen but no oxygen. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010010573(A) 申请公布日期 2010.01.14
申请号 JP20080170629 申请日期 2008.06.30
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 ONO TETSUO;SAITO TAKESHI
分类号 H01L21/3065;G03F7/42;H01L21/304 主分类号 H01L21/3065
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