SPIN COATING METHOD, APPARATUS THEREFOR, METHOD OF PRODUCING SOLID IMAGING ELEMENT, AND METHOD OF PRODUCING DEVICE

摘要

<P>PROBLEM TO BE SOLVED: To enhance the uniformity of the film thickness in the plane of a wafer by spin coating. Ž<P>SOLUTION: A coating material 201 is applied onto a wafer 200 by spin coating while the wafer 200 is kept in a forcibly warped state wherein its outer circumferential part of the wafer 200 is elevated relative to its center part. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž