发明名称 RESIN COMPOSITION FOR SEALING LIGHT-EMITTING DEVICE AND LAMP
摘要 A resin composition for sealing a light-emitting device of the present invention includes a silsesquioxane resin including two or more oxetanyl groups, an aliphatic hydrocarbon including one or more epoxy groups and a cationic polymerization initiator. Furthermore, a lamp of the present invention includes a package equipped with a cup-shaped sealing member, an electrode exposed in the bottom portion of the sealing member, and a light-emitting device arranged on the bottom portion and electrically connected with the electrode, wherein the light-emitting device is sealed with the above-described resin composition for sealing a light-emitting device filled in the sealing member.
申请公布号 US2010006887(A1) 申请公布日期 2010.01.14
申请号 US20070374764 申请日期 2007.12.27
申请人 SHOWA DENKO K.K. 发明人 TAKEI TOMOYUKI;SAKATA YUKO
分类号 H01L33/00;C08L71/02;H01L33/56 主分类号 H01L33/00
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