INTERLAYER CONNECTING MEMBER FOR MULTILAYER PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE INTERLAYER CONNECTING MEMBER, MULTILAYER PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING THE MULTILAYER PRINTED WIRING BOARD

摘要

Disclosed is an interlayer connecting member (10) for a multilayer printed wiring board (30) that can realize a high metal ball positioning accuracy, does not cause any residue and the like after drilling or laser beam machining, and is free from a thermal influence during machining.  Also disclosed is a multilayer printed wiring board (30) using the interlayer connecting member (10).  The interlayer connecting member (10) comprises an insulating resin sheet (12) of a heat curing resin, a bore part (24) provided at predetermined positions in the resin sheet (12), and a copper ball (14) that is received in the bore part (24) and has a diameter larger than the thickness of the resin sheet (12).  The bore part (24) is formed by heating the resin sheet (12) to a semicured state and stinging a convexed member (22) on predetermined positions of the resin sheet (12).  In such a state that the copper ball (14) is sandwiched and held between insulating substrates (25, 35), the copper ball (14) is crushed to a predetermined proportion to cause plastic deformation, whereby the copper ball (14) is bonded by metallic bonding to electrodes (28, 38) in the respective insulating substrates (25, 35).