| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device of favorable mass productivity achieving reduction of reflection on a bonding wire and further chip size reduction while maintaining favorable optical characteristics, and to provide an optical print head using this light-emitting device. <P>SOLUTION: The device includes a circuit board 1, a first electrode pad 2 provided on the circuit board 1, a light-emitting element chip 3 disposed on the circuit board 1 and having a light-emitting part 4, a second square electrode pad 5 provided on the light-emitting element chip 3 and the bonding wire 6 whose first bond 6a is connected to the first electrode pad 2 and second bond 6b is connected to the second electrode pad 5. The bonding wire 6 is provided such that a straight line connecting together the first bond 6a and the second bond 6b is oriented in the diagonal direction of the second electrode pad 5. <P>COPYRIGHT: (C)2010,JPO&INPIT |
