| 摘要 |
<P>PROBLEM TO BE SOLVED: To securely mount a peripheral type flip chip on a printed circuit board. <P>SOLUTION: The printed circuit board 12 has a printed wiring board 22 having a first surface and a second surface on the side opposite from the first surface, a plurality of first electrodes formed on the first surface, a plurality of second electrodes 23b provided nearby and in accordance with the plurality of first electrodes respectively and formed on the first surface, a plurality of third electrodes respectively electrically connecting the plurality of first electrodes to the plurality of second electrodes respectively corresponding to the plurality of first electrodes, solder 25 applied respectively over the first electrodes, the second electrodes 23b corresponding to the first electrodes, and the third electrodes connecting the first and second electrodes to each other, and the flip chip 30 mounted on the first surface and electrically connected at positions respectively opposed to the plurality of first electrodes. <P>COPYRIGHT: (C)2010,JPO&INPIT |
