| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive conductive paste which achieves high-definition pattern resolution by a photolithographic method, enables to form an electrode pattern having low resistance, and can suppress thickening of the paste due to a reaction of glass frit with an organic component. <P>SOLUTION: The photosensitive conductive paste contains 5-50 mass% of glass frit containing ≥60 and <80 mass% Bi<SB>2</SB>O<SB>3</SB>and having a softening point in a range of 400-500°C in a photosensitive conductive paste containing a conductive powder and a photosensitive organic component. The glass frit has an average particle size of 0.5-1.5 μm, a 90% particle size of 1-3 μm and a top size of ≤7 μm, and has a coefficient of thermal expansion at 30-300°C of (75×10<SP>-7</SP>) to (120×10<SP>-7</SP>)/°C. <P>COPYRIGHT: (C)2010,JPO&INPIT |
