| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To shorten a processing step for a wafer which has a recessed portion and a remaining edge portion. <P>SOLUTION: A sheet peeling device 10 includes a table 11 which holds the semiconductor wafer W, a peeling means 12 of peeling an adhesion sheet S stuck on the semiconductor wafer W, and a reforming means 13 of irradiating the semiconductor wafer W with laser light to form a brittle portion WE. The semiconductor wafer W has the recessed portion W1 and the remaining edge portion W2 connecting with an outer circumference of the recessed portion W1. The reforming means 13 forms the brittle portion WE at the remaining edge portion W2 and an outer edge of a bottom surface W1a. The adhesion sheet S is peeled to peel the adhesion sheet S in a state where the remaining edge portion W2 is bonded, from a formation region of the recessed portion W1a while dividing the formation region of the recessed portion W1a and the remaining edge portion W2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
