| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is miniaturized and high reliable, and has a contact resistance reduced to a value as low as possible between a bus bar and a main electrode (a power dissipation reduced to a value as low as possible between them) without forming screw holes in the bus bar and the main electrode. SOLUTION: A power module 4 comprises a case 20, a main electrode 24 electrically connected to a semiconductor element 14 placed in a case 20, a fixing member 62 including a tip part 63, a clamper 60 for clamping the fixing member 62, and a bus bar 30 which is sandwiched between the tip part 63 of the fixing member 62 and the main electrode 24 and electrically connected to the main electrode 24. COPYRIGHT: (C)2010,JPO&INPIT |
