| 摘要 |
PROBLEM TO BE SOLVED: To provide a single wafer cleaning apparatus capable of preventing mutual contamination between cleaned objects which occurs when a backside of the cleaned object and a cleaning apparatus are in contact with each other, and suppressing reattachment of a cleaning liquid and cleaned dirt on the cleaned object. SOLUTION: The single wafer cleaning apparatus includes at least a chuck pin for holding a side surface of the cleaned object, a flange arranged beneath the cleaned object and having a discharge port for discharging a liquid, and a liquid splash preventing plate arranged on an outer side of the flange for preventing splash of the liquid discharged from the flange. A backside of the cleaned object is floated with a liquid by the flange in a non-contact state, and the chuck pin holds the side surface of the cleaned object to clean the cleaned object. COPYRIGHT: (C)2010,JPO&INPIT |
