| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutter for a support tape of a semiconductor wafer capable of easily curvedly removing an unnecessary part of the support tape while reducing the risk of leaving a scar and hardly damaging a frame without the need for frequently replacing the cutter. SOLUTION: This invention is provided for removing the unnecessary part of the support tape adhered to the frame while moving the cutter 20, by adhering the support tape adhered to the semiconductor wafer to the hollow frame. The cutter 20 is composed of a moving holder 23 movable in the peripheral direction of the frame, a support piece 24 threadably attached to the moving holder 23, a guide roller 25 journaled to the support piece 24 and contacting with the support tape, and a blade part 26 for cutting the support tape by an edge part 27 journaled by the support piece 24 and projecting downward more than an under surface contacting with the support tape of the guide roller 25. The moving holder 23 can be rocked to the support tape, and the edge part 27 is positioned on the rear side in the moving direction of the moving holder 23. COPYRIGHT: (C)2010,JPO&INPIT |
