| 摘要 |
PROBLEM TO BE SOLVED: To prevent a wafer from breaking etc., when a peeling tape is stuck. SOLUTION: A sheet peeling device 10 includes a table 11 which holds the semiconductor wafer W, a pressing means 15 of pressing the peeling tape PT against an adhesion sheet S to stick it, a moving means 16 of relatively moving the peeling tape PT stuck on the adhesion sheet S and the tape 11 to peel the adhesion sheet S, and a control means 19 which includes a storage means 43 of storing the diameter W1 of the semiconductor wafer W and the diameter of the adhesion sheet S through a prescribed input means and controls the sticking position of the peeling tape PT on the basis of the data stored in the storage means 43. COPYRIGHT: (C)2010,JPO&INPIT |
