| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a separation of a joined part due to a warpage of a substrate and thereby to achieve a joining with a high dimensional precision. Ž<P>SOLUTION: A substrate joining method for joining a first and second substrates by using a plurality of adhesives having different flexibilities includes: a machining step of forming grooves or holes at least in either of the first and second substrates; an applying position determining step of determining applying positions of the adhesives to the joining surfaces between the first and second substrates, according to a warpage state of the substrate where the grooves or the holes are formed; an applying step of applying the adhesives to the joining surface of the first or second substrate, according to the applying positions of the adhesives, determined in the applying position determining step; and a joining step of joining the first and second substrates via the adhesives, and of curing the adhesives. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
