发明名称 |
LITHOGRAPHIC METHOD FOR WIRING A SIDE SURFACE OF A SUBSTRATE |
摘要 |
In a lithographic proximity method for wiring an end or internal side surface of a substrate the required exposure of strips (76), defining the wiring pattern, is performed by means of a mask (70) comprising a diffraction structure (74) to deflect exposure radiation (b) to the side surface. An exposure beam, which is perpendicularly incident on the mask, is used so that enhanced tolerance for proximity gap width variations is obtained. The method allows manufacture of accurate and fine wiring.
|
申请公布号 |
US2010009140(A1) |
申请公布日期 |
2010.01.14 |
申请号 |
US20090559574 |
申请日期 |
2009.09.15 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
NELLISSEN ANTONIUS JOHANNES MARIA |
分类号 |
B32B3/10;G03F1/00;G03F7/20 |
主分类号 |
B32B3/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|