| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductive bump that is deformed easily by low pressure and easily passes through an adhesive resin layer, such as NCF, and to provide a method of forming the conductive bump, and an electronic component mounting structure using the formation method. <P>SOLUTION: The conductive bump 11 formed on an electrode of an electronic component includes: a first bump 14 having one or more layers formed on the electrode and including a photosensitive resin containing a spherical-shaped conductive filler, and a second bump 15 formed on an upper surface of the first bump 14 and including a photosensitive resin containing a scale-shaped conductive filler. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
