| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board and a multilayer printed wiring board device, capable of integrating component mounting steps in one step. <P>SOLUTION: The multilayer printed wiring board device is provided which bears BGA type electronic parts (BGA parts). A power supply via connected to a power supply layer and a ground via connected to a ground layer are provided in a central area surrounded by a power supply pad and a ground pad connected to BGA components. With this arrangement, a decoupling effect caused by a C component occurs between vias. The decoupling effect caused by a C component also occurs between layers, because the power supply via is connected to the power supply layer and the ground via is connected to the ground layer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
