| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring connection device and a wiring connection method, capable of obtaining sufficient reliability in wiring connection with a simple device configuration. <P>SOLUTION: The wiring connection device includes a punch jig 32, a laser oscillating device 53, and a pressing jig 71. The punch jig 32 has punches 36, and forms bonding portions in an interconnector 21 by the punch 36. The laser oscillating device 53 heats the interconnector 21 and joins electrodes and the bonding portions. The pressing jig 71 is arranged on the interconnector 21 and fixes the interconnector 21 in a forming process by the punch jig 32 and a heating treatment by the laser oscillating device 53. In the pressing jig 71, guide holes for passing the punch 36 in a forming process by the punch jig 32 and a passing hole for passing the laser beam generated from the laser oscillating device 53 in the heating treatment by the laser oscillating device 53 are formed by common through-holes 73. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
