| 摘要 |
To obtain a moving body cooling apparatus which can improve cooling performance through efficient use of traveling wind produced as a moving body is running. The direction of grooves 4f formed by flat-shaped cooling fins 4c provided integrally with a base portion 4a to which semiconductor devices to be cooled are affixed is inclined from a moving direction of a car body 1 which is an example of a moving body. As the car body 1 runs, traveling wind passes through the grooves 4f as shown by an arrow C. As the length of the grooves 4f becomes shorter, pressure loss due to passage of the wind decreases, flow rate of the wind increases, and the amount of heat to be removed from the flat-shaped cooling fins 4c on both sides of each groove 4f decreases. Therefore, temperature increase in the traveling wind is reduced and cooling performance is improved.
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