MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF

摘要

Disclosed is a microstructure which has excellent long-term stability and can be bonded readily and at high bonding strength by thermocompression bonding.  The microstructure comprises an insulating base material which has penetrating micropores each having a pore diameter of 10 to 500 nm at a density of 1 × 106 to 1 × 1010 pores/mm2.  In the inside of each of the penetrating micropores, a metal is filled at a filling rate of 30% or more.  On at least one surface of the insulating base material, a layer comprising a polymer is arranged.