摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate inspection method capable of shortening an inspection time by reducing the number of times of color recognition required in inspecting a mounting state of an electronic component. <P>SOLUTION: The substrate inspection method for inspecting whether the electronic component is mounted on an electronic component mounting part of a mounting surface of a substrate, includes a process for setting a color of the mounting surface of the substrate as a reference of inspection to be a reference color, a process for imaging the mounting part of the electronic component from above the mounting surface, a process for recognizing a color of the imaged mounting part, a process for comparing the recognized color and the reference color, and a process for inspecting the mounting state of the electronic component based on a comparison result. When the color of the mounting surface of the substrate to be inspected is different from the reference color, a color range of the reference color is changed and the mounting state of the electronic component is inspected. <P>COPYRIGHT: (C)2010,JPO&INPIT |