| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultra-thin wiring substrate with high-density wiring that can suppress the generation of warpage, and to provide a method for manufacturing therefor. SOLUTION: A first build-up insulation layer 11 where a build-up wiring conductor 5 is provided and a second insulation layer 15 are stacked in this order on upper and lower surfaces of an insulation substrate 3 for core where a wiring conductor 2 for a core is provided from the upper surface to the lower surface. The insulation substrate 3 and the first insulation layer 11 contain a reinforcing material, and the second insulation layer 15 does not contain it. Assuming that the thickness of the insulation substrate 3 is a, that of the first insulation layer 11 is b and that of the second insulation layer 15 is c, the wiring substrate 10 includes a relationship of a>b>c among a, b, and c, and the substrate is manufactured by such a method. COPYRIGHT: (C)2010,JPO&INPIT |
