| 摘要 |
PROBLEM TO BE SOLVED: To provide an electromagnetic bandgap structure and a printed circuit board including the same. SOLUTION: The electromagnetic bandgap structure includes a plurality of conductive plates positioned between two conductive layers, and a stitching via 745 for electrically connecting the two conductive plates respectively out of the conductive plates. The stitching via 745 includes a first via 741 of which one end is connected to one of the two conductive plates, a second via 742 of which one end is connected to the other of the two conductive plates, and a connection pattern 743 positioned on a plane different from the conductive plates between the two conductive layers and electrically connecting the other end of the first via and the other end of the second via. One of the first via and the second via is formed so as to pass through a same plane of at least one of the two conductive layers. COPYRIGHT: (C)2010,JPO&INPIT |
