| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for molding a photosensitive resin which prevents the remainder of bubbles in a molding and can directly form a flat surface in the molding made of the photosensitive resin. SOLUTION: The photosensitive resin molding apparatus 1 comprises a substrate 3 on which the molding W made of the photosensitive resin is mounted, a press plate 4 which is made of a translucent material and installed above the substrate 3, a light source 5 installed above the press plate 4, a lifting mechanism which makes the press plate 4 contactable/separable in relation to the molding W with the molding W mounted on the substrate 3, a pressurization mechanism which pressurizes the molding W mounted on the substrate 3 between the substrate 3 and the press plate 4, and a decompression chamber 2 which makes the inside decompressible with a mounting surface 3a on the side on which the molding W is mounted of the substrate 3, the molding W, and a contact surface 7a on the side which contacts the molding W of the press plate 4 held in the inside. COPYRIGHT: (C)2010,JPO&INPIT |
