| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a specimen making method and device for sampling (picking) only a specimen piece including a desired specified region out of semiconductor wafers or device chips and mounting it to the specimen stage of an analyzing/measuring device without the need for a specimen-making manual process requiring experiences, skills and a time. Ž<P>SOLUTION: The specimen making device uses technology for FIB processing, the transfer of the picked specimen, and the fixation of the picked specimen to a specimen holder. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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