Arrangement for mounting an electric component on a carrier such as printed circuit board, where the carrier comprises a contact surface for electrically contacting a connection of the component

摘要

The arrangement for mounting an electric component on a carrier (2), where the carrier comprises a contact surface for electrically contacting a connection of the component, is claimed. The contact surface comprises a first part area (16a) and a second part area (16b), which are electrically connected through applying an ignition element. The connection of the component is connected with the ignition element and/or with the part areas. The ignition element is subjected with a stimulation energy by which an exothermic ignition process of the ignition element is initiated. The arrangement for mounting an electric component on a carrier (2), where the carrier comprises a contact surface for electrically contacting a connection of the component, is claimed. The contact surface comprises a first part area (16a) and a second part area (16b), which are electrically connected through applying an ignition element. The connection of the component is connected with the ignition element and/or with the part areas. The ignition element is subjected with a stimulation energy by which an exothermic ignition process of the ignition element is initiated in order to connect connection of the component with one of the part areas of the contact surfaces. The ignition element is formed as multi-layered foil with a layer made of aluminum and nickel, which react during an activation under heat discharge. The first part area is electrical conductively connected over a first electric line with a first electric connection element (13a). The second part area is electrical conductively connected over a second electric line with a second electric connection element (13b). The ignition element is subjected for initiating the ignition process with a first current impulse, which is realizable through the application of electric voltage between the first connection element and the second connection element. The electric connection elements are arranged on the carrier. The electric lines comprise a section, which is formed for separating the electric conductive connection between the respective part area and the connection elements. The section comprises a reduced line cross section so that it is intersected through a further current impulse, whose intensity is higher than the first current impulse. The first and/or the second part areas and/or the connection of the component are coated with a soldering means so that a soldering connection is produced through the exothermic reaction. The carrier comprises further contact surfaces with respective further first and second part areas and the respective first part areas of the contact surface are connected with the first connection element and the second part areas are connected with the second connection element.