| 摘要 |
Provided is a chip-size packaging device which achieves low-cost, size reduction, thickness reduction, weight reduction, and furthermore, high reliability by using a glass substrate having a through electrode. The packaging device uses a glass substrate (11) whereupon a plurality of through electrodes (11b) are arranged at predetermined positions on a base member of a package wherein a device element having an electrode group is stored, and the electrode group and the through electrode (11b) are extracted to an external circuit through a contact medium arranged by bypassing the electrode group, the through electrode (11b) and a sealing material (14). |
