| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding ball that is hard to cut. <P>SOLUTION: The wire bonding ball, wherein it has a fillet at an interface between the bonding wire and the ball. The wire comprises a core and a coating layer, and the bonding wire, wherein X is 0.005 or smaller, if X = a coating layer area/(a core area + a coating area) at the section of the bonding wire. The bonding wire, wherein the melting point of an alloy formed of the core and the coating layer of the wire is lower than those of the core and of the coating layer. The manufacturing method of the bonding wire, wherein the wire is finally annealed and the coating layer is subsequently coated. The manufacturing method of the wire bonding ball, wherein Y is 3 or more, if Y = discharge current value (milliamperes)/discharge time (milliseconds). <P>COPYRIGHT: (C)2006,JPO&NCIPI |
