发明名称 SLURRY COMPOSITION FOR A CHEMICAL MECHANICAL POLISHING, METHOD OF PREPARING THE SLURRY COMPOSITION AND METHOD OF POLISHING AN OBJECT USING THE SLURRY COMPOSITION
摘要 PURPOSE: A slurry composition is provided to reduce the content of macro particles using abrasive particles in which the shape and size of crystals are controlled and has narrow particle size distribution and to suppress the generation of scratch on an object for polishing. CONSTITUTION: A method for manufacturing a slurry composition for chemical mechanical polishing comprises the steps of: precipitating rare earths metal salts excluding cerium and cerium salts in a water-soluble medium to prepare the precipitate containing rare earths metal and cerium; heat-treating the precipitate to prepare pre-ceria abrasive particles doped with rare earth materials; pulverizing the pre-ceria abrasive particles to prepare ceria abrasive particle; and dispersing the ceria abrasive particle in a water-soluble dispersive medium.
申请公布号 KR20100004181(A) 申请公布日期 2010.01.13
申请号 KR20080064217 申请日期 2008.07.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SANG KYUN;KIM, NAM SOO;KIM, JONG WOO;HAN, CHOONG HO
分类号 C09K3/14;H01L21/304 主分类号 C09K3/14
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