BONDING METHOD USING STRIP BUMPS

摘要

PURPOSE: A bonding method using strip bumps is provided to improve productivity and quality by forming an under fill and with an ultrasonic bonding of a strip bump of a metal material formed on a chip and a substrate. CONSTITUTION: In a bonding method using strip bumps, strip bump are formed on the chip(21) and the substrate respectively. An under fill is formed on the substrate in which strip bumps(23,24) are formed. The under fill between the strip bump is removed by aligning the Chip and the substrate(22) and applying the ultrasonic wave to them. The under fill is hardened by combing the strip bump on the chip and the substrate. The under fill is hardened through ultrasonic wave solid-state junction.