发明名称 Nonvolatile memory device and method of fabricating the same
摘要 <p>A nonvolatile memory device having lower bit line contact resistance and a method of fabricating the same is provided. In the nonvolatile memory device, a semiconductor substrate of a first conductivity type may include first and second fins. A common bit line electrode may connect one end of the first fin to one end of the second fin. A plurality of control gate electrodes may cover the first and second fins and expand across the top surface of each of the first and second fins. A first string selection gate electrode may be positioned between the common bit line electrode and the plurality of control gate electrodes. The first string selection gate electrode may cover the first and second fins and expand across the top surface of each of the first and second fins. A second string selection gate electrode may be positioned between the first string selection gate electrode and the plurality of control gate electrodes. The second string selection gate electrode may cover the first and second fins and expand across the top surface of each of the first and second fins. The first fin under the first string selection gate electrode and the second fin under the second string selection gate electrode may have a second conductivity type opposite to the first conductivity type. </p>
申请公布号 EP1939934(A3) 申请公布日期 2010.01.13
申请号 EP20070150246 申请日期 2007.12.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, WON-JOO;PARK, YOON-DONG;KOO, JUNE-MO;KIM, SUK-PIL;BYUN, SUNG-JAE
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
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