SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to perform a routing wiring efficiently by using a chip align mark instead of a dummy bump. CONSTITUTION: A semiconductor package comprises a substrate(210) and a semiconductor chip(110) which is arranged on the substrate. The chip align mark(150) is formed on the one-side of the semiconductor chip. A wiring pattern is formed on the one-side of the substrate. The chip align mark is bonded with the wiring pattern. The bump(120a) and the routing wiring are formed on the one-side of the semiconductor chip. The routing wiring is electrically connected to the bump. The routing wiring is extended to the center of the semiconductor chip. The chip align mark is not arranged between the center of the semiconductor chip and the bump. The chip align mark is arranged on an outer corner of the semiconductor chip.