发明名称 |
PIEZOELECTRIC DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
<p>Upper adhesion layer 35 formed between piezoelectricity layer 32 and upper electrode layer 34 so as to abut on piezoelectricity layer 32 and upper electrode layer 34 is included. Upper adhesion layer 35 includes first tungsten layer 47 made of tungsten in which an ± phase and a ² phase coexist and second tungsten layer 48 made of ±-phase tungsten. First tungsten layer 47 is configured so as to abut on piezoelectricity layer 32. It is possible to obtain a piezoelectric device which is capable of improving the adhesion property of both the piezoelectricity layer and the electrode layer and reducing a basic point voltage fluctuation at the time of high-temperature operation so as to improve reliability.</p> |
申请公布号 |
EP2144309(A1) |
申请公布日期 |
2010.01.13 |
申请号 |
EP20080751599 |
申请日期 |
2008.04.24 |
申请人 |
PANASONIC CORPORATION |
发明人 |
HAYASHI, MICHIHIKO;YASUMI, MASAHIRO;OKAMOTO, SHOJI |
分类号 |
H01L41/08;G01C19/56;G01C19/5607;G01C19/5628;H01L41/29;H01L41/316;H01L41/319 |
主分类号 |
H01L41/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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