APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An apparatus for manufacturing a semiconductor package is provided to prevent a scratch on a bottom part of the substrate moving along an index rail. CONSTITUTION: An index rail(14) transfers a substrate(10) to one direction. A preheating unit(16) preheats a substrate supplied to the index rail and a semiconductor chip attached on a substrate. A package manufacturing unit(18) attaches a semiconductor chip(12) on the substrate supplied to the index rail and connects the semiconductor chip and the substrate with a wire. A substrate base part(30) suppresses the sag of the substrate in the index rail. The substrate support unit is comprised of a roller positioned on the lower side of the substrate. A support block is installed on the lower side of the support block to support the roller. The roller is protruded to the surface of the support block and supports the substrate.