发明名称 |
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same |
摘要 |
A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided. |
申请公布号 |
US7646098(B2) |
申请公布日期 |
2010.01.12 |
申请号 |
US20080081042 |
申请日期 |
2008.04.10 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
JAPP ROBERT M.;MARKOVICH VOYA R.;PAPATHOMAS KOSTAS I.;POLIKS MARK D. |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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