LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A light emitting device package and a manufacturing method thereof are provided to reduce a leakage current by implementing a dual insulation layer by forming a first insulation layer and a second insulation layer. CONSTITUTION: A metal package substrate(110) includes a cavity for mounting a light emitting diode(150). A first insulation layer(121) is formed on the metal package substrate. A second insulation layer(122) is formed on the first insulation layer. At least one electrode pattern(131,132) is formed on the second insulation layer. The light emitting diode is mounted on the cavity. A junction layer(140) is formed between the electrode pattern and the light emitting diode. The metal package substrate is made of aluminum or the alloy including the aluminum.