HEAT-CURABLE SILICONE RESIN-EPOXY RESIN COMPOSITION, AND PREMOLDED PACKAGE MOLDED FROM SAME

摘要

PURPOSE: A heat-curable silicone resin-epoxy resin composition is provided to ensure excellent hardening property and strength, to maintain heat resistance and light-proof property for a long term, and to form a cured material with little yellowing. CONSTITUTION: A heat-curable silicone resin-epoxy resin composition comprises (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The mass ratio of (A) component / (B) component is within 5/95 - 95/5.