发明名称 |
Component built-in wiring board and manufacturing method of component built-in wiring board |
摘要 |
To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
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申请公布号 |
US7644497(B2) |
申请公布日期 |
2010.01.12 |
申请号 |
US20080007924 |
申请日期 |
2008.01.17 |
申请人 |
DAI NIPPON PRINTING CO., LTD. |
发明人 |
IMAMURA TATSURO;YAMAGUCHI YUJI;SHINOZAKI KAZUHIRO;SHIBAZAKI SATOSHI;FUKUOKA YOSHITAKA;HIRAI HIROYUKI;SHIMADA OSAMU;SASAOKA KENJI;MATSUMURA KENICHI |
分类号 |
H05K3/30;H05K1/18;H05K3/36;H05K3/46 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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